Semtech Leverages Packaging, Process Innovations in New 3.3V ESD Protection Device

New µClamp3324P comes in leadless package that is up to 77% smaller than competing solutions; flow-through design simplifies board layout

Camarillo, California - September 20, 2005

Semtech Corp. (Nasdaq: SMTC), a leading supplier of analog and mixed-signal semiconductors for communications, portable devices, computers, and industrial equipment, today announced the new µClamp™3324P, a low-voltage, four-line electrostatic discharge (ESD) protection device that features packaging and design innovations for an ultra-small size and simplified board layout.

Part of Semtech's MicroClamp™ ESD protection family, the µClamp™3324P is a 3.3V device that comes in Semtech's new SLP2116P8 leadless package, which measures only 2.1 x 1.6 x 0.58 mm. The µClamp™3324P has a flow-through design that enables it to be used near connectors simplifying board design when compared to competitive multi-line ESD protection devices that require significant board redesign. The µClamp™3324P replaces four discrete devices such as multilayer varistors, reducing the space needed for ESD protection by 77%. Internally, the device is constructed using Semtech's patented EPD TVS process technology yielding true 3.3 volt operating devices.

"This device is designed for the many portable systems that still rely on single-line discrete devices for protection solely because they are easier to lay out on the board," said Tom Dugan, Semtech's Director of Protection Products. "Given that the power connector in today's cell phone designs can call for up to 24 lines of protection, the benefit of this new MicroClamp product in terms of board space savings is dramatic." Designed for cell phones, digital still cameras, notebook computers and other portable systems, the Clamp3324P provides low working and clamping voltage for superior protection of sensitive ICs in high ESD threat environments.

The leadless design along with a large ground pad at the bottom of the device reduces the parasitic inductance, for better IC protection. The device exceeds the IEC protection standards for ESD and electrical fast transient (EFT) protection./p>

The lead-free design of the device meets worldwide environmental and regulatory requirements including the European Unions Restriction on Hazardous Substances in Electrical and Electronic Equipment (RoHS) directive.

Key Features of the µClamp™3324P

  • Exceeds IEC 61000-4-2 standard for ESD protection (15kV air, 8kV contact)
  • Meets IEC 61000-4-4 standard for EFT protection(40A, tp=5/50ns)
  • 3.3V working voltage
  • Typical capacitance < 30pF (VR = 0V)
  • Lead-free design that is RoHs compliant
  • 8-pin SLP2116P8 package (2.1 x 1.6 x 0.58 mm)

Pricing and Availability

The µClamp™3324P is available immediately in production quantities and is priced at $0.41 each in 1,000-piece lots. Ordering code is µClamp3324P.TCT. Semtech offers comprehensive design assistance, including field- and factory-based support. Data sheets, volume pricing, and delivery quotes, as well as evaluation kits and samples, are available by contacting salesinfo@semtech.com.

About Semtech

Semtech Corporation is a leading supplier of high-quality analog and mixed-signal semiconductor products. The company is dedicated to providing customers with proprietary solutions and breakthrough technology in power management, protection, advanced communications, human interface, test & measurement, and wireless connectivity products. Publicly traded since 1967, Semtech is listed on the NASDAQ National Market under the symbol SMTC. For more information, contact Semtech Corp. at 200 Flynn Road, Camarillo, CA 93012-8790; phone (805) 498-2111; email to info@semtech.com; or visit its web site at www.semtech.com.

Semtech, the Semtech logo, MicroClamp and µClamp are marks of Semtech Corporation.

Press Contact

Terry Sears, Marketing Communications Manager, Telephone: 805.498.2111

 

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